Heat sink for IC packaging

Usage:
Our package expedites heat radiation from chips to avoid overheating and malfunction. The package also helps prevent chips from external shocks and damages.

Features:
1. High-precision 3D stamping technique.
2. Professional full process production: available of custom-made products on design, tooling, stamping and surface treatment.
3. Various choices of surface treatment, such as high anti-corrosion, black oxide, anodizing, etc.